Job Offer: IC Package Design Engineer

Your Task is to design and simulate state of the art Flip-Chip-, Wirebond-, and Chip-Scale-Packages for integrated circuits. To design the optimal IC-Package you will work in close cooperation to our chip design teams.

Job Description:

Your Tasks will be a subset of the following:

• Design and layout the optimal IC-Package using State of the Art tools and technologies
  • Select the IC package type based on the given specifications and IC requirements
  • Physical Co-Design of IC packages (bump and pad-ring planning)
  • Consider design for manufacturability (DFM) and optimize the cost
  • Ensure all signals can be routed, and all power supplies can be decoupled on the PCB board
  • Generate all data for substrate manufacturer and assembly
• Perform signal and power integrity simulations within the system including the PCB and IC-Package
  
  • Ensure system level signal and power integrity
  • Extract models of PCB and IC-package using 3D/2D EM simulations
  • Generate models of IC-interfaces for fast electrical signal and power integrity simulations
  • Early estimate and simulate the voltage drop within the package and the system
  • Derive and document guidelines for the PCB designer, generate target impedance
• Document and report your results
• Communicate frequently to the substrate manufacturer and assembly partners
• Stay informed about the IC packaging market and supply chain 

Requirements:

• Bachelor’s/Master’s degree in Electrical Engineering, Communications Engineering, Information Technology or equivalent
• Knowledge in layout of layered substrate and manufacturing (package substrate or PCB design)
• Knowledge in time and frequency domain modelling
• Knowledge in scripting for design automation (e.g. Python / Perl / TCL / VBA) would be a plus
• Self-Driven and hands-on way of working
• Strong analytical and solution-oriented thinking
• Good written and oral communication skills in English and German
• Team-player

Knowledge in any of these tools would be a plus:

• Cadence Allegro, Cadence APD, Mentor Xpedition, Altium Designer
• CST Studio Suite, Ansys HFSS, Ansys Q3D, Ansys SIwave, Cadence Sigirty
• Cadence Virtuoso

Location:

Dresden, Germany

Employment Type:

Full-time (up to 40 hours per week)

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About us:

Racyics® is Europe’s leading design service partner for mixed-signal system-on-chip design and turnkey services in advanced nodes.

We deliver professional analog, digital and mixed-signal design services tailored to the customers’ needs with focus on realization of complex System-on-Chips in leading edge technology nodes. Our team of more than 120 employees covers the complete chip design process up to system architecture development. Racyics is working for major German and international semi-custom companies, both as a service provider and in collaborative partnerships.

Working at Racyics comes with many benefits, including flexible working hours, mobile work, a financial contribution to your childcare costs and great team events.