Racyics® in-house IC package development enables co-design and verification of the IC packages in short development cycles and offers state-of-the-art IC packaging solutions from low to high volume.
When it comes to IC packaging, we have carefully chosen various BGA array sizes that enable the integration of flip chips with state-of-the-art bump-out pitches. These packages can be manufactured by multiple suppliers from low to high volumes. Next to Prototype Packaging Technology, Racyics® offers a Flip Chip Package design service for common Ball Grid Array (FCBGA) sizes. This is particularly beneficial for ICs with high signal and power integrity requirements.
Additionally, Racyics® provides an integrated Package co-design Service for IC customers. We offer services at all stages of the package design cycle, from feasibility study and package technology selection to layout and detailed EM-simulations (model extraction).
With package co-design at Racyics® the IC bump-out and package layout can be matched up from the beginning.
PACKAGE FEASIBILITY AND IMPLEMENTATION
With package co-design at Racyics, the IC and package can be matched up from the beginning. This approach avoids unnecessary effort in packaging, such as additional routing layers for fanout routing, subsequent signal flipping or unnecessary high on die capacitance and ultimately reduces piece-cost.
Regardless of whether it is for a feasibility study, package technology selection, or final layout sign-off, we provide comprehensive verification capabilities at every stage of the package design cycle.
For prototype integrated circuits (ICs) such as MPW, Racyics provides a laminate based IC packaging solution. We offer three different no-lead wire bond frames, with up to 200 pins, that can be soldered like a conventional package.
Individual layouts are possible, which allow for special routing of certain signals, such as high speed traces or an individual cavity.
For selected BGA sizes, our prepared design templates can be used to speed up the design process. Simulation models for the templates are available from the beginning.
Our design rules are carefully selected so that these layouts can be produced from multiple sources within Europe, using well-established processes from prototype to medium volumes. Racyics can organize the flip chip production as a service at our partners.
With our packaging service integrated in your IC-design process, we guarantee the best possible signal and power integrity, along with the shortest possible optimization cycles directly within Racycis.
Available Prototype Packages
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