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Home » News » Archive » General News » Racyics at the Bonding Fair, Dresden

Racyics at the Bonding Fair, Dresden


Dresden − June 19, 2022 −

Are you interested in Integrated Circuits and would like to meet Europeans leading IC Design provider?
Meet us at the Bonding Fair today and tomorrow in Dresden.


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Racyics GmbH
Bergstraße 56
01069 Dresden
Germany

phone+49 (0)351 41 88 72-0print+49 (0)351 41 88 72-99mailcontact@racyics.comlanguagewww.racyics.com

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    • Design Services
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    • Racyics® ABX Platform
    • makeChip
  • News
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  • Career
    • Jobs
  • Contact Us
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