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Home » News » Archive » General News » Racyics at the Bonding Fair, Dresden

Racyics at the Bonding Fair, Dresden


Dresden − June 19, 2022 −

Are you interested in Integrated Circuits and would like to meet Europeans leading IC Design provider?
Meet us at the Bonding Fair today and tomorrow in Dresden.


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01069 Dresden
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    • Racyics® ABX Platform
    • makeChip
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    • Open Positions
  • Contact Us
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