The Racyics Christmas Wish Tree campaign once again supported children and young people during the 2025 holiday season. ... Read more ›
As 2025 comes to a close, Racyics looks back on a year of steady progress and strong collaboration. ... Read more ›
Racyics contributed to a project focused on building a fully European chiplet supply chain. Together with consortium partner ... Read more ›
Racyics was present at the EFECS 2025 partner event in Malta after being officially selected as a Design ... Read more ›
Racyics participated in this year’s Design And Reuse IP-SoC EU Days in Grenoble. During the event, Patrick Döll, ... Read more ›
the makeChip platform has been selected as a Design Enablement Team (DET) under the EU Chips Act. This ... Read more ›
Efficient power optimization is becoming increasingly critical as power budgets tighten and design complexity continues to grow. At ... Read more ›
Are you studying electrical engineering, computer science, microelectronics, or a related field and curious about what working in ... Read more ›
Modern technologies require a joint design process for ICs and their IC packages. A tight alignment with IC ... Read more ›
Racyics is proud to contribute its energy-efficient chip design expertise. Our CEO, Holger Eisenreich, will speak at RUBIN ... Read more ›
Despite the heavy rain before and during the REWE Team Challenge Run, our Racyics team powered through and ... Read more ›
Dr.-Ing. Mikail Yayla, Senior Digital IC Design Engineer and team lead at Racyics, presented at SNUG Europe 2025 ... Read more ›
This year, four of our expert engineers from Racyics will deliver several specialized lectures in the IC Design ... Read more ›
In mid-January, Racyics taped out the QSolid ULV testchip, featuring innovative testing structures for SRAM timing measurements and ... Read more ›
Enabled on makeChip and powered by Racyics ABX platform, the SpiNNaker2 chip forms the core of the newly ... Read more ›
Racyics is heading to Silicon Valley to share our latest IP offering, makeChip design platform and IP design ... Read more ›
This week, we were happy to welcome our Deutschlandstipendium scholarship students to the Dresden office! On Monday, students ... Read more ›
At Racyics, our Physical Implementation Line helps bring digital chip designs to life—turning ideas into real, manufacturable chips ... Read more ›
This year we went to the beautiful city of Lyon and participated at the Design, Automation and Test ... Read more ›
We are excited to be featured in a recent Global Foundries® blog! The Racyics ABX Platform for GlobalFoundries ... Read more ›
Our team at #EmbeddedWorld 2025 is having a great time, and we’re already at the halfway point! We’re ... Read more ›
📅Visit us at Hall 4, Booth 4-573 to learn about our innovative solutions: ➡️ Proven Track Record in ... Read more ›
It’s always a pleasure for us to share industry insights with the next generation of engineers. Over the ... Read more ›
Once again, Racyics participated at the Technische Universität Dresden event as a sponsor of the Deutschland Stipendium. Last ... Read more ›
Racyics got the chance to discuss with Design And Reuse how makeChip enables customers to successfully design complex ... Read more ›
DATE YPP is a program designed to support early career professionals in building valuable skills and advancing their ... Read more ›
During the IC Design lecture series last year, we had the pleasure of meeting Alexander Persicke, a student ... Read more ›
Through our Christmas Wish Tree Campaign, Racyics made holiday wishes come true for children in need. A heartfelt ... Read more ›