Chiplet Supply Chain in Saxony: Advancing IC Integration in Europe

Racyics contributed to a project focused on building a fully European chiplet supply chain. Together with consortium partner Technische Universität Dresden and with support from Sächsische Aufbaubank (SAB), the project aimed to strengthen the foundation for next-generation semiconductor innovation.

The goal of the initiative was to develop and demonstrate advanced integration technologies for chiplet-based systems. A key focus was enabling small to mid-volume production within Europe, supporting greater independence in semiconductor manufacturing.

Racyics played an important role by contributing its expertise in energy-efficient IC design and advanced packaging. The company led activities in package design and supported coordination across the supply chain. These efforts helped establish a technological basis for future applications in areas such as automotive, telecommunications, aerospace, and artificial intelligence.

The project represents an important step toward strengthening Europe’s semiconductor ecosystem and highlights Racyics’ role as a design partner for chiplet-based systems.