Racyics @ Semi 3D & Systems Summit

From June 26th to June 28th, Racyics was an exhibitor and sponsor at the Semi 3D & Systems Summit at the Hilton Dresden – with 175 participants, 19 exhibitors, and a top-notch program.

Our colleagues from the IC Packaging Line Department were listening to exciting speaker sessions about “Smarter Systems through Heterogeneous Integration”.

In addition, our esteemed colleague Michael had the opportunity to introduce Racyics and our state-of-the-art IC packaging technology.

In the evening, a networking event was held, which was also attended by the mayor of Dresden, Dirk Hilbert.