Racyics® in-house IC package development enables co-design and verification of the IC packages in short development cycles and offers state-of-the-art IC packaging solutions from low to high volume.
When it comes to IC packaging, we have carefully chosen various BGA array sizes that enable the integration of flip chips with state-of-the-art bump-out pitches. These packages can be manufactured by multiple suppliers from low to high volumes. Next to Prototype Packaging Technology, Racyics® offers a Flip Chip Package design service for common Ball Grid Array (FCBGA) sizes. This is particularly beneficial for ICs with high signal and power integrity requirements.
Additionally, Racyics® provides an integrated Package co-design Service for IC customers. We offer services at all stages of the package design cycle, from feasibility study and package technology selection to layout and detailed EM-simulations (model extraction).
With package co-design at Racyics® the IC bump-out and package layout can be matched up from the beginning.
| PACKAGE FEASIBILITY AND IMPLEMENTATION With package co-design at Racyics, the IC and package can be matched up from the beginning. This approach avoids unnecessary effort in packaging, such as additional routing layers for fanout routing, subsequent signal flipping or unnecessary high on die capacitance and ultimately reduces piece-cost. |
| PACKAGE VERIFICATION Regardless of whether it is for a feasibility study, package technology selection, or final layout sign-off, we provide comprehensive verification capabilities at every stage of the package design cycle. |
From prototype to series production, we offer flexible BGA/LGA packages for Flip-Chips and Wire-Bonded Chips. The footprint can be equipped with a user-specific BGA or LGA matrix or adapted to standard packages such as QFN. The package is fully encapsulated using transfer molding.
For selected sizes, design templates with matching simulation models are available. Carefully defined design rules ensure that layouts can be manufactured by multiple sources.
For prototype integrated circuits (ICs) such as MPW, Racyics provides a laminate based IC packaging solution. We offer three different no-lead wire bond frames, with up to 200 pins, that can be soldered like a conventional package.
Individual layouts are possible, which allow for special routing of certain signals, such as high speed traces or an individual cavity.
With our packaging service integrated in your IC-design process, we guarantee the best possible signal and power integrity, along with the shortest possible optimization cycles directly within Racycis.
Available IC Packages
BGA/LGA Package | |
RIQP-64 | |
RIQP-80 | |
RIQP-148 |
Are you interested or do you have any questions? |