Integrated IC and Package Design

Modern technologies require a joint design process for ICs and their IC packages. A tight alignment with IC and package design is essential for optimizing the overall performance, costs, and manufacturability. Especially with flip chip, low-power systems, and complex packaging hierarchies, successful tape-outs rely on seamless co-design.

To meet these demands, Racyics has a dedicated Packaging Team that supports customers from early feasibility and package selection to layout, simulation, and seamless transition from prototype to production. As a fabless design house, we work closely with trusted manufacturing partners to ensure smooth, reliable execution.​​
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How Projects Benefit from Racyics IC-Packaging Service​​
● Faster Feasibility & Package Selection​
Get an early decision on the right package technology based on electrical, mechanical and commercial factors like availability, cost, and lead time.​​
● Seamless Co-Design & Layout​​
Our packaging team works in tight integration with IC designers to align pad and bump planning with the package layout. This co-design approach avoids costly iterations and unnecessary routing complexity, This results in better electrical performance and lower unit cost.​​
● Simulation & Verification​​
Signal and power integrity are verified through EM simulations. Electrical models (SPICE netlists, S-Parameters) are extracted at the layout level and can be simulated together with the IC before tape-out.​​
● Aligned Manufacturing​
We support all steps needed for data handoff to manufacturing, including GDS, ODB++ or Gerber data export, bond diagrams and detailed assembly instructions.​​
● From First Prototype to Series Production​
We support both prototypes and series production. Our packaging experience ranges from wirebond to advanced flip chip designs, using laminate-based packaging substrates.​

Starting from Proven Solutions​
With a proven track record and several years of successful IC packaging projects, we’ve developed a portfolio of reference packaging that perform reliably across multiple applications. Each design consists of a dedicated IC packaging technology and layout template. These validated solutions are now also available on our website.​​
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Why start from scratch when you can build on success? Starting from a working solution brings major advantages:​​
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● Avoid unnecessary design iterations between chip design, package design, substrate manufacturing and assembly​
● Predict electrical behavior early with validated models​​
● Increase confidence in yield, cost, and production timelines​​
● Reduce project and technical risk across the entire flow​​
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With Racyics as your IC-packaging partner, you benefit from a team that understands the system as a whole, because we co-design the IC and IC-package from the beginning. ​​
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​Contact us to explore how our packaging solutions can help you get to silicon faster: https://racyics.de/services/package-service/