Racyics at GTC2018 and IEE S3S
October 29, 2018 −
Racyics® started the promotion tour for the Racyics® ABX Platform Solution for 22FDX® technology.
Our Co-Founder and CEO Holger Eisenreich presented the benefits of the Racyics® Adaptive Body Bias Platform for GLOBALFOUNDRIES® 22FDX® at the GTC in Munich and IEEE S3S conference.
Co-Founder and CEO Holger Eisenreich at IEEE S3S in San Francisco
GTC
GLOBALFOUNDRIES Tech Conference highlights the latest in foundry technology and ASIC design services available from GLOBALFOUNDRIES and its partners.
IEE S3S
The IEE S3S conference covers the most relevant and state-of-the-art technology topics including 3D Integration, Ultra Low Power Circuits and Devices, and Silicon on Insulator Technology. The conference has been a place where the newest results on Ultra-Low Power Circuits are discussed and shared.