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Home » News » Archive » 2025

Archive for Year: 2025


12 Sep
Integrated IC and Package Design

Modern technologies require a joint design process for ICs and their IC packages. A tight alignment with IC ... Read more ›

02 Jul
RUBIN EdgeVision Edge AI Workshop

Racyics is proud to contribute its energy-efficient chip design expertise. Our CEO, Holger Eisenreich, will speak at RUBIN ... Read more ›

05 Jun
Rewe Team Challenge 2024

Despite the heavy rain before and during the REWE Team Challenge Run, our Racyics team powered through and ... Read more ›

30 May
Racyics Presents EdgeVision SoC at SNUG Europe 2025!

Dr.-Ing. Mikail Yayla, Senior Digital IC Design Engineer and team lead at Racyics, presented at SNUG Europe 2025 ... Read more ›

15 May
Join the Racyics Lecture Series at Technische Universität Dresden!

This year, four of our expert engineers from Racyics will deliver several specialized lectures in the IC Design ... Read more ›

08 May
Exciting Milestone: Awaiting Fab-Out of the QSolidULV Testchip!​

In mid-January, Racyics taped out the QSolid ULV testchip, featuring innovative testing structures for SRAM timing measurements and ... Read more ›

24 Apr
Enabled on makeChip and powered by Racyics, the SpiNNaker2 chip forms the core of the newly launched SpiNNcould supercomputer!

Enabled on makeChip and powered by Racyics ABX platform, the SpiNNaker2 chip forms the core of the newly ... Read more ›

17 Apr
Racyics is going to Design and Reuse IP-SoC Silicon Valley 2025!

Racyics is heading to Silicon Valley to share our latest IP offering, makeChip design platform and IP design ... Read more ›

10 Apr
Our scholarship recipients visit our Dresden office🎓

This week, we were happy to welcome our Deutschlandstipendium scholarship students to the Dresden office! On Monday, students ... Read more ›

03 Apr
Introduction to our Physical Implementation Line

At Racyics, our Physical Implementation Line helps bring digital chip designs to life—turning ideas into real, manufacturable chips ... Read more ›

27 Mar
Racyics goes to DATE 2025 in Lyon!

This year we went to the beautiful city of Lyon and participated at the Design, Automation and Test ... Read more ›

14 Mar
Featured in GlobalFoundries Blog​

We are excited to be featured in a recent Global Foundries® blog!​ The Racyics ABX Platform for GlobalFoundries ... Read more ›

13 Mar
Embedded World 2025!

Our team at #EmbeddedWorld 2025 is having a great time, and we’re already at the halfway point! We’re ... Read more ›

27 Feb
Join us at Embedded World!

📅Visit us at Hall 4, Booth 4-573 to learn about our innovative solutions: ➡️ Proven Track Record in ... Read more ›

13 Feb
Racyics is pleased to support universities with guest lectures once again!

It’s always a pleasure for us to share industry insights with the next generation of engineers. Over the ... Read more ›

06 Feb
Supporting the young talents and engineers of tomorrow

Once again, Racyics participated at the Technische Universität Dresden event as a sponsor of the Deutschland Stipendium. Last ... Read more ›

30 Jan
Interview with Design and Reuse: “How makeChip Simplifies SoC Design”

Racyics got the chance to discuss with Design And Reuse how makeChip enables customers to successfully design complex ... Read more ›

17 Jan
Our Success Story: Meeting Mikail Yayla at DATE YPP

DATE YPP is a program designed to support early career professionals in building valuable skills and advancing their ... Read more ›

10 Jan
From IC Design Lectures to Racyics

During the IC Design lecture series last year, we had the pleasure of meeting Alexander Persicke, a student ... Read more ›

03 Jan
General News
Christmas Wish Tree Campaign

Through our Christmas Wish Tree Campaign, Racyics made holiday wishes come true for children in need. A heartfelt ... Read more ›

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