Racyics at embedded world 2026 in Nuremberg

Racyics will participate in embedded world 2026, taking place from 10–12 March in Nuremberg. During the event, the company will present its latest developments in mixed-signal SoC design, IP solutions, and design enablement services.

Visitors to the Racyics booth will have the opportunity to learn more about the company’s full service portfolio, including turnkey ASIC development, design services, IP products, and access to foundry technologies. The team on site will include Holger Eisenreich, Johannes Uhlig, Sebastian Höppner, Florian Bilstein, Marcus Pietzsch, Michael Dittrich, Alexander Persicke, and Patrick Döll.

Booth Information

Location: Hall 4, Booth 4-552

At the booth, Racyics will showcase several live demonstrations. These include a newly developed Edge AI SoC, where visitors can explore real-time recognition capabilities in an interactive setup. In addition, the company will present its ABX solution, demonstrating high energy efficiency, as well as advanced packaging approaches, including UCIe-based chiplet solutions.

Visitors can also learn more about makeChip, Racyics’ cloud-based design enablement platform, and discover how it supports the development of innovative semiconductor solutions.

Racyics looks forward to welcoming visitors in Nuremberg and to engaging in discussions on future chip design challenges and opportunities!